Medical Engineering
Medical Engineering

Medical adhesives – innovative, reliable, and optimized for specific applications

The requirements for materials used in medical technology are particularly high. In addition to mechanical and thermal stresses, they must maintain their functionality even under intensive use. Medical adhesives that are not only highly resilient to mechanical stress but also resistant to sterilization and X-rays are particularly in demand in this context.

Adhesives for medical technology: the most important product properties

  • Solvent-free and low-emission, which favors use in medical devices
  • Flexible epoxy resin that also cushions thermal stresses, thus minimizing tension
  • Transparent adhesive bond, ideal for optical applications
  • Moderate curing temperature, which protects temperature-sensitive substrates
  • High X-ray resistance, essential epoxy for imaging systems such as computer tomographs
  • Sterilization-resistant epoxy resin to maintain the adhesive bond even after repeated treatment in an autoclave
  • Optimized viscosity for easy and precise application
  • Working time of 20–25 minutes at room temperature, ideal for series production
  • Low shrinkage, reducing stress cracks and deformation in the cured state

Which adhesives are suitable for medical technology?

The requirements for medical adhesives are high – they must not only adhere reliably, but also fulfill special properties such as sterilization resistance or X-ray resistance. EPOXONIC offers a comprehensive range of adhesives for medical technology that meet these requirements. The following products are particularly suitable:

  • EPOXONIC 341: A thermally conductive epoxy resin with a long service life and high crack resistance – ideal for large-volume components subject to thermal stress. Due to its stability at low temperatures, it is a proven epoxy resin for medical technology, e.g., in implant systems or sensor components.
  • EPOXONIC 363: Thanks to its low viscosity and moderate curing temperature, this epoxy resin enables the encapsulation of complex geometries, such as in medical technology components. It minimizes capillary effects and can be applied with precision – a clear advantage in high-precision applications.
  • EPOXONIC 382: This medical adhesive system impresses with its low viscosity and good curing at room temperature. It is particularly suitable for optically sensitive applications, as it offers high transparency as an epoxy resin for diagnostic devices and epoxy for imaging systems.
Product name EPOXONIC 33 EPOXONIC 340 EPOXONIC 344
Operating temperature -40 °C to +150 °C -40 °C to +150 °C -40 °C to +150 °C
Glass transition temperature Tg [°C] 85 30 125
Shore hardness D 82 D 30 D 92
Thermal conductivity [W/mK] 0,5 n.d. 0,7
Dielectric strength [kV/mm] 35 n.d. > 25
Surface resistivity [Ωcm] 9,6 x 1014 n.d. 1,5 x 1015
Specific volume resistivity [Ωcm] 2,3 x 1014 n.d. 2,0 x 1015

Here you can download the complete standard product portfolio of EPOXONIC.

Typical applications of medical adhesives

  • Diagnostic devices: bonding optical components in analyzers and microscopes where transparency and mechanical stability are crucial
  • Imaging systems: bonding light-conducting or imaging components in MRI or CT devices where the epoxy for imaging systems must not produce image artifacts
  • Computed tomography: use of X-ray-resistant epoxy resins for mounting structural components without compromising image quality
  • Patient monitoring: protection and fixation of sensitive sensors in vital signs monitoring devices – resistant to disinfectants and thermal cycles
  • Implantable systems: use of sterilization-resistant epoxy resins for reliable sealing of electrical and mechanical interfaces
  • Medical displays: bonding of touch elements and display units with flexible epoxy resin that can withstand temperature fluctuation and mechanical stress
  • Housing bonding: adhesives for medical technology components with different coefficients of expansion, for even stress distribution
  • Sensors and printed circuit boards: flat potting of electronic assemblies, even with complex geometries – for lasting protection against moisture and vibration

Medical adhesives from EPOXONIC – quality meets versatility

For decades, EPOXONIC has been synonymous with high-performance epoxy resin-based adhesive solutions. Our adhesives for medical technology are specially tailored to the high demands of the industry – from sterility and durability to optical clarity.


Our portfolio includes:

  • Epoxy resin for diagnostic equipment
  • Epoxy resin for computed tomography
  • X-ray-resistant epoxy resin
  • Adhesives for medical device components with high temperature and medium resistance
  • Flexible epoxy resin for bonding different materials
  • Sterilization-resistant epoxy resin for long-term stable applications

Our solutions ensure the functionality of sensitive systems – permanently, precisely, and reliably. Contact us for individual advice.

EPOXONIC adhesives for Medical Engineering

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In addition to numerous epoxy resin formulations, we also offer adhesives and casting resins for professional further processing as part of industrial applications.

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