Epoxy Resin Formulations for Microelectronics – Meeting the Highest Standards of Precision and Reliability
In microelectronics, precision and reliability are crucial for the functionality and longevity of electronic components. Epoxy resins play a central role here, as they provide excellent protective and adhesive properties. Specialized epoxy resin formulations are key to meeting the increasing demands of this high-tech field.
Key product properties:
- High insulating performance: Epoxy resins offer excellent electrical insulation, which is essential for the functionality of sensitive electronic components.
- Thermal stability: Thermal loads in microelectronics are high. Epoxy resins can withstand temperatures of up to 150 °C and beyond without losing stability.
- Chemical resistance: Epoxy resins exhibit high resistance to aggressive chemicals that may occur during manufacturing processes or in service.
- Mechanical stability: Epoxy resin formulations provide mechanical stability and protect against external influences.
- Adjustable viscosity: The viscosity of the resin can be modified to ensure good processability and to avoid air entrapment.
- Strong adhesion: Ensures strong adhesion to the substrate.
- Flexibility / toughness: Adjustment of flexibility or toughening to withstand thermal expansion of components.
- Adjustable curing time: The curing time of the resin can be varied to optimize the production process.
Which adhesives are suitable for microelectronics?
In microelectronics, the highest levels of precision and reliability are required—especially when selecting suitable adhesives and potting compounds. In addition to electrical insulation performance, thermal conductivity, low stress during curing, and suitability for temperature-sensitive components all play a key role. To meet these demanding requirements, EPOXONIC offers a range of specialized products. The most important EPOXONIC products for microelectronics are EPOXONIC 364, EPOXONIC 283, and EPOXONIC 352:
- EPOXONIC 283: Specifically developed for potting temperature-sensitive electronic assemblies, this casting resin impresses with its gentle curing behavior. In addition, EPOXONIC 283 is suitable for high-voltage components and provides excellent electrical insulation properties.
- EPOXONIC 352: EPOXONIC 352 is particularly suitable for potting electrical and electronic components with high requirements for resistance to temperature cycling and chemical resistance.
- EPOXONIC 364: This adhesive is ideally suited for low-stress potting of sensitive components. Thanks to its thermally conductive properties, EPOXONIC 364 is also used for bonding heat sinks to electronic assemblies. It is ideal for applications where efficient heat dissipation is critical.
| Product name | EPOXONIC 283 | EPOXONIC 352 | EPOXONIC 364 |
|---|---|---|---|
| Operating temperature | -40 °C to +150 °C | -40 °C to +150 °C | -40 °C to +150 °C |
| Glass transition temperature Tg [°C] | 100 | 105 | -40 |
| Shore hardness | D 92 | D 90 | A 70 |
| Fire behaviour UL 94 | n.d. | V0 | n.d. |
| Thermal conductivity [W/mK] | 0,5 | 0,9 | 1,4 |
| Water absorption [%] | n.d. | < 0,1 (24 h / 23 °C) |
0,33 (24 h / 23 °C) |
| Dielectric strength [kV/mm] | 40 (60°C) | > 20 | n.d. |
Here you can download the complete standard product portfolio of EPOXONIC.
Areas of Application of Epoxy Resin Formulations in Microelectronics
Epoxy resins are used in many areas of microelectronics, with applications continuously increasing. The versatility of this material and the ability to develop specific epoxy resin formulations tailored to your requirements are an ongoing challenge for us:
- Casting of electronic components: Protection of sensors and microchips against external influences by encapsulating them in an epoxy resin protective housing.
- Encapsulation of chips and wire bonds: Protection of chips and wires against corrosion and moisture, particularly in semiconductor manufacturing.
- Use of epoxy resin as an adhesive: Reliable mechanical bonding and electrical insulation of various electronic components—indispensable in chip assembly.
Epoxy Resin Formulations for Microelectronics: Why EPOXONIC Is Your Reliable Partner
For more than three decades, EPOXONIC has stood for innovative solutions in the field of epoxy resin formulations. Thanks to our long-standing experience and in-depth expertise, we develop epoxy resin formulations for microelectronics that meet the highest quality standards and are precisely tailored to the requirements of the industry.
Our portfolio includes:
- Specialized epoxy resin formulations for potting electronic components
- Custom-made epoxy resin formulations for the encapsulation of chips and wire bonding
- Epoxy resins as adhesives for chip assembly
We impress not only with innovative products, but also with comprehensive consulting and solutions for special requirements -
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In addition to numerous epoxy resin formulations, we also offer adhesives and casting resins for professional further processing as part of industrial applications.