ADHESIVE BONDING
Epoxy resin adhesives – strong bonds for the most demanding requirements
Epoxy resin adhesives are among the most powerful bonding systems in the industry. They offer outstanding adhesion to a wide range of substrates, high mechanical strength, and excellent resistance to chemical and thermal influences. They are used particularly in automotive engineering, microelectronics, and optoelectronics, where bonds must be durable, precise, and robust.
For decades, EPOXONIC has developed a diverse portfolio of one- and two-component epoxy resins, specifically engineered for the purpose of demanding series production. These epoxy resin adhesives enable precise, reliable bonding – both on the production line and in highly automated applications.
1-component epoxy resin – reliable and efficient
A 1K epoxy adhesive is a ready-to-use system that can be processed directly, eliminating the need to monitor a mixing ratio. Curing takes place through temperature or UV light. 1-component epoxy resin is particularly well suited for automated processes with high cycle frequencies and is characterized by its ease of use – ideal for precise applications on metal, glass, and plastics.
2-component epoxy resin – strong performance for industrial applications
2K epoxy adhesive consists of two components – resin and hardener – which must be mixed precisely. They offer a defined pot life, providing a specific window for application before curing begins. These 2-component adhesives for metals, plastics and glass are characterized by high strength, impact resistance, and excellent chemical resistance. They are particularly suitable for large-area structural bonding and demanding long-term applications.
The most important product features:
- high shear strength up to 70 MPa depending on substrate
- excellent impact resistance for applications subject to vibration and shock
- thermal resistance up to +150 °C in continuous operation
- chemical resistance to oils, solvents, and moisture
- good adhesion to metals, plastics (PA, PC, PBT), and glass
- transparency for UV or optoelectronic applications
- low viscosity for precise dosing and thin adhesive layers
- solvent-free formulations for environmentally friendly processes
The most important epoxy resin adhesives from EPOXONIC:
- EPOXONIC 292: This is a tough, elastic, single-component adhesive for metal (particularly suitable for bonding magnets in electric motors). It has shear strengths of up to 70 MPa. The epoxy resin is also characterized by high chemical resistance and moderate curing temperatures. This also makes it ideal for the manufacture of steel/elastomer composite components.
- EPOXONIC 369: This is a toughened two-component epoxy resin for low-stress bonding of materials with different expansion rates. High chemical resistance, shear strength up to 50 MPa, and good transparency make this epoxy resin adhesive ideal for microelectronics and automotive engineering.
- EPOXONIC 372: A UV-curing, flexibilized, one-component epoxy resin adhesive for bonding metal, glass, and plastic. With shear strengths up to 43 MPa on glass, high transparency, and a refractive index of 1.5, it is ideal for optical applications in microelectronics.
| Product name | EPOXONIC 292 | EPOXONIC 369 | EPOXONIC 372 |
|---|---|---|---|
| Operating temperature | -40 °C to +150 °C | -40 °C to +150 °C | -40 °C to +150 °C |
| 1-Part Adhesive (1K) or 2-Part Adhesive (2K) | 1K | 2K | 1K |
| Pot life at 25°C | > 7 d | 1 h | 6 mon |
| Glass transition temperature Tg [°C] | 125 | 90 | n.d. |
| Shore hardness | n.d. | D 80 | D 60 |
| Coefficient of linear thermal expansion [ppm/K] | 50 | n.d. | n.d. |
| Shear strength at 25°C [MPa] | 70 (Aluminium) | 50 (Aluminium) | 43 (Glass) |
Here you can download the complete standard product portfolio of EPOXONIC.
Areas of application for epoxy resin adhesives in industry and technology
Epoxy resin adhesives are used in a wide variety of areas where precise, robust, and durable bonds are required:
- automotive engineering: sensor encapsulation, magnet bonding, housing assembly
- microelectronics & electrical engineering: encapsulation and protection of sensitive components, PCB bonding
- optoelectronics: lens bonding, fiber optic assembly, transparent bonding
- communication technology: fiber optic bonding, signal transmission in optical systems
- hybrid construction & structural bonding: 2-component adhesive for metal, plastics, and glass in multi-component modules
Whether as a 1-component or 2-component adhesive, EPOXONIC systems offer excellent process reliability, technical performance, and broad application flexibility.
Epoxy resin adhesives – EPOXONIC is your reliable partner for bonding solutions
EPOXONIC has been developing and producing highly specialized epoxy resin adhesives for over 30 years. Our portfolio includes both single-component adhesives for metal, plastic, and glass, as well as complex two-component epoxy resins for high-performance structural bonding. We work with our customers to develop customized solutions – from product development to series integration. If you would like to learn more about our epoxy resin adhesives, please contact us for technical advice.
You are not quite sure yet which product suits you?
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- Are you looking for suitable casting resins and adhesives?
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We will find and develop the right product for you!
In addition to numerous epoxy resin formulations, we also offer adhesives and casting resins for professional further processing as part of industrial applications.