Optoelectronic adhesives – precision and reliability for high-tech applications
Optoelectronics plays a key role in modern technology and requires adhesives that guarantee maximum precision. Whether in LED technology, fiber optic bonding, or microoptics, optoelectronic adhesives must not only create mechanical bonds, but also ensure loss-free transmission of optical signals. EPOXONIC offers specially developed adhesives for this purpose, which impress with their excellent adhesive strength, minimal shrinkage, and optical clarity.
Key product features
- adhesive with high optical clarity: high light transmission for loss-free signal transmission
- Low viscosity: good flow properties, ideal for thin layers
- Non-yellowing: long-term optical clarity
- UV curability: fast curing with controlled irradiation
- Thermal curability: precise curing with high cross-linking density
- Dual-cure function: combination of UV and thermal curing
- High impact strength: resistance to mechanical stress
- Temperature resistance: use at high and low temperatures (e.g., -40 °C to +150 °C)
- Low stress: minimizes cracking and optical distortions
- Solvent-free: no outgassing, prevents optical clouding
- Chemical resistance: protection against moisture and aggressive media
- Fast curing: reduced process times, ideal for series production
- Refractive index: adapted to optical components for clear signal transmission
Which adhesives are suitable for optoelectronics?
Selecting the right adhesive for optoelectronic applications requires particular care, as optical properties are just as important as mechanical stability. Optically transparent adhesives are primarily used here, as they ensure loss-free light transmission and thus safeguard the functionality of sensitive components:
- EPOXONIC 195: When a combination of UV and thermal curing is required, e.g., to bond shaded areas, EPOXONIC 195 comes into play. The dual-cure system enables fast UV fixation with high mechanical strength through subsequent thermal curing.
- EPOXONIC 372: EPOXONIC 372 offers an excellent solution for applications that require particularly fast curing. This single-component, UV-curing adhesive bonds metals, plastics, and glass in seconds while remaining impact-resistant and slightly flexible.
- EPOXONIC 382: Optically transparent adhesives, such as EPOXONIC 382, are characterized by low viscosity and good curing at room temperature. With its transparency, this adhesive is ideal for large-area bonding of temperature-sensitive substrates.
| Product name | EPOXONIC 195 | EPOXONIC 372 | EPOXONIC 382 |
|---|---|---|---|
| Operating temperature range | -40 °C to +150 °C | -40 °C to +150 °C | -40 °C to +150 °C |
| Single-component (1K) or two-component (2K) | 1K | 1K | 2K |
| Viscosity at 25 °C [mPas] | 800 | 2000 | 450 |
| Curing time [h/°C] | 10 s / 60 mW/cm2 UVA + 0,5 / 150 | 240 s / 60 mW/cm2 UVA | 10 / 25 + 12 / 50 |
| Glass transition temperature Tg [°C] | 145 | n.b. | 70 |
| Shore hardness | D 85 | D 60 | D 85 |
| Shear strength at 25 °C [MPa] | 40 (aluminium) | 43 (glass) | 45 (aluminium) |
You can download the entire standard product range from EPOXONIC here.
As your partner for adhesives in optoelectronics, we supply you with more than just products – we offer expertise, reliability, and customized bonding solutions.
Areas of application for optically transparent adhesives in optoelectronics
- Lens bonding: fixing lens systems in optical devices such as cameras, microscopes, and lasers without compromising optical clarity
- Optical fiber coupling: connecting glass fibers and optical fibers for loss-free signal transmission in communication systems
- Adhesive for LED components: mounting LED chips on substrates to ensure uniform light distribution and protection from external influences
- Microoptics: precise connection of miniature components such as sensors, micromirrors, and optical chips
- Displays and touchscreens: connection solutions for communication electronics using transparent adhesives to minimize reflections and maintain optical quality
- Wafer-level optics: bonding of optical elements to wafer substrates for the production of microlenses and diffractive optics
- Protective coatings: protection against moisture, dust, and chemical influences while maintaining high light transmission
- Optical sensors: ensuring precise signal transmission in camera sensors, photodiodes, and other optical components
Areas of application for optically transparent adhesives in optoelectronics
- Lens bonding: fixing lens systems in optical devices such as cameras, microscopes, and lasers without compromising optical clarity
- Optical fiber coupling: connecting glass fibers and optical fibers for loss-free signal transmission in communication systems
- Adhesive for LED components: mounting LED chips on substrates to ensure uniform light distribution and protection from external influences
- Microoptics: precise connection of miniature components such as sensors, micromirrors, and optical chips
- Displays and touchscreens: connection solutions for communication electronics using transparent adhesives to minimize reflections and maintain optical quality
- Wafer-level optics: bonding of optical elements to wafer substrates for the production of microlenses and diffractive optics
- Protective coatings: protection against moisture, dust, and chemical influences while maintaining high light transmission
- Optical sensors: ensuring precise signal transmission in camera sensors, photodiodes, and other optical components