Epoxy Casting Compounds and Adhesives in Electronic Applications
Epoxy-based casting compounds and adhesives play a central role in modern electronics manufacturing and industrial applications. Epoxy resins are among the most commonly used potting materials, offering an excellent balance of mechanical strength, chemical resistance, and electrical insulation. Learn more about the functions and properties of epoxy potting compounds!
Key product properties
- Protection against environmental influences: Prevents the ingress of moisture, dust, dirt, and other harmful environmental factors
- High electrical insulation: Forms a stable and reliable insulating layer, even in high-voltage applications
- Mechanical stability & impact resistance: Protects components against shocks, vibrations, and mechanical stress
- High solvent & chemical resistance: Remains dimensionally stable and reliable in environments with oils, cleaning agents, or aggressive chemicals
- Thermal stability & heat dissipation: Withstands high temperatures while efficiently dissipating excess heat
- Low shrinkage & dimensional stability: Minimal internal stress during curing – crucial for complex or delicate assemblies
- Tamper protection: The solid encapsulation of electronics makes unauthorized access more difficult
Which potting compound is suitable for electronic applications?
Not every potting compound is suitable for every application. That is why EPOXONIC offers a broad portfolio of specially developed solutions, precisely tailored to technical requirements and industry-specific operating conditions. Whether high temperatures, mechanical loads, or sensitive electronic components – at EPOXONIC you will find the potting compound that perfectly fits your project.
- EPOXONIC 33 is particularly suitable for low-stress potting of temperature-sensitive electronic components (e.g., flat assemblies). It impresses with its high electrical insulation performance (dielectric strength of 35 kV/mm) and a Shore hardness of D 82.
- EPOXONIC 340 is especially suited for potting, sealing, and bonding electronic components such as relays. It offers a particularly flexible potting solution with low Shore hardness (D 30), making it ideal for stress-sensitive components.
- EPOXONIC 344 is a highly filled, solvent-free system with excellent chemical resistance and high mechanical strength (Shore D 92, thermal conductivity 0.7 W/mK). It is especially suitable for high-voltage connectors and robust assemblies.
| Product name | EPOXONIC 33 | EPOXONIC 340 | EPOXONIC 344 |
|---|---|---|---|
| Operating temperature | -40 °C to +150 °C | -40 °C to +150 °C | -40 °C to +150 °C |
| Glass transition temperature Tg [°C] | 85 | 30 | 125 |
| Shore hardness | D 82 | D 30 | D 92 |
| Thermal conductivity [W/mK] | 0,5 | n.d. | 0,7 |
| Dielectric strength [kV/mm] | 35 | n.d. | > 25 |
| Surface resistivity [Ωcm] | 9,6 x 1014 | n.d. | 1,5 x 1015 |
| Specific volume resistivity [Ωcm] | 2,3 x 1014 | n.d. | 2,0 x 1015 |
Here you can download the complete standard product portfolio of EPOXONIC.
Potting Compounds in Electronics – Versatile Applications for Epoxy Resins
- Transformers: Potting protects windings from moisture, improves heat dissipation, and increases electrical insulation.
- Coils and chokes: Minimization of vibrations and noise, as well as protection against short circuits through solid encapsulation.
- Power and control electronics: Potting of power modules (e.g. IGBTs or MOSFETs) to protect against heat, dust, and moisture in industrial environments.
- Printed circuit boards (PCBs): Complete encapsulation of electronic components protects against dust, chemicals, and moisture, while increasing mechanical
- trength.
- Sensors and actuators: Robust protection in industrial applications against aggressive environments (e.g. vibrations, heat, cold, and moisture).
Connectors and contacts: Prevention of short circuits and corrosion – especially in outdoor applications or humid environments.
Potting Compounds in Electronics – Epoxy Resins from EPOXONIC
Find the right epoxy potting compound for your electronic applications from our standard solutions, or contact us personally for an individual consultation – our team will be happy to develop a suitable product precisely tailored to your needs and requirements. Whether you require a flexible potting compound for electronics, adhesives, or hard casting resins, EPOXONIC supports you in selecting the right product. Submit your individual inquiry now and find the right solution!
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In addition to numerous epoxy resin formulations, we also offer adhesives and casting resins for professional further processing as part of industrial applications.